Heatspreader Material
High-performance materials with high thermal conductivity and coefficient of thermal expansion suitable for electronic devices.
● Optimum materials for heat management of semiconductor devices
- Cu-W (Copper Tungsten)
- CuDia (Copper Diamond)
- AlN (Aluminium Nitride)
- Cu-Mo (Copper Molybdenum)
● Manufactured in Japan by Sumitomo Electric Group company, ALMT
